Request a detailed pricing estimate or consult with our specialists to map out your requirements.
Tell us about your project, and we’ll get back to you with pricing in 24 hours.
Describe what you're working on, and our engineering team will point you in the right direction.
Dual-sided probing solutions designed to extend test coverage, enabling simultaneous top and bottom contact access for high-density and multi-layer circuit boards.
Top-Side Probing mechanisms deliver specialized, high-precision access solutions required to test complex double-sided printed circuit board assemblies (PCBAs). As electronic devices become increasingly compact and dense, component placement and electrical test points are frequently distributed across both the top and bottom layers of the circuit board. Standard bottom-only test fixtures are often insufficient to achieve complete node access. Customizing test fixtures with dedicated top-side probing assemblies allows test systems to contact surface-mount test pads, component leads, and top-mounted connectors simultaneously alongside standard bottom-side probes.
Integrating top-side probing structures into In-Circuit Test (ICT) and Functional Test (FCT) fixtures significantly increases overall test coverage without requiring secondary test steps or multiple board passes. Precision-engineered top pressure plates house custom probe boards (press-top cassettes) outfitted with spring-loaded pogo pins that align perfectly with top-side target points during fixture closure. This dual-sided contact capability guarantees that high-density boards, complex multi-layer circuits, and power electronics can be fully validated for electrical continuity, signal integrity, and component presence within a single, continuous test cycle.
Mechanical Precision & Dual-Sided Access
Enables simultaneous electrical probing of both top and bottom PCBA surfaces within a single fixture press cycle.
Features high-accuracy guide pins, linear alignment bushings, and rigid top-cassette plates to ensure precise probe-to-target alignment on fine-pitch pads.
Distributes downward and upward probing forces evenly across the board surface to eliminate mechanical bowing, trace strain, or substrate damage.
Shielding & Application Versatility
Achieves maximum fault coverage on complex double-sided assemblies, reducing the risk of untested nodes moving downstream.
Eliminates the need to flip boards or run separate testing operations for top-side and bottom-side circuitry, cutting line takt time.
Incorporates swappable top-side probe plates to facilitate fast changeovers between different board variants on the same base fixture.
We combine state-of-the-art manufacturing with stringent quality control to ensure smooth test operations, zero false failures, and maximum uptime. By offering our custom engineering solutions at competitive prices and with rapid lead times, we provide the reliable testing infrastructure you need to scale production without compromising your schedule or bottom line.
Partner with us to scale your products with confidence, knowing your testing infrastructure is built to perform.
Copyright © 2026 Fixtronic
